Comparison of Glycine and Citric Acid as Complexing Agents in Copper Chemical-Mechanical Polishing Slurries

Materials Research Society Symposium - Proceedings

Volumn 767, Issue , 2003, Pages 279-284

  Gorantla, Venkata ^a   Babu, S V ^a  

^a Clarkson University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COMPLEXATION; DISSOLUTION; ELECTROCHEMISTRY; ORGANIC ACIDS; PH; REACTION KINETICS; SLURRIES;

HYDROXYL RADICALS;

COPPER;

EID: 0242322613     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-767-f6.7     Document Type: Conference Paper

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