Electrodeposition of copper from sulfate electrolytes. Effects of thiourea on resistivity and electrodeposition mechanism of copper

Electrochemical and Solid-State Letters

Volumn 4, Issue 2, 2001, Pages

  Donepudi, V S ^a   Venkatachalapathy, Rajeev ^a   Ozemoyah, Peter O ^a   Johnson, C S ^b   Prakash, Jai ^a  

^a ILLINOIS INSTITUTE OF TECHNOLOGY   (United States)

^b ARGONNE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CATHODES; CHEMISORPTION; CURRENT DENSITY; ELECTRIC CONDUCTIVITY MEASUREMENT; ELECTROCHEMISTRY; ELECTRODEPOSITION; ELECTROLYTES; POLARIZATION; PROBES; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; SULFUR COMPOUNDS;

CATHODIC OVERPOLARIZATION; FOUR POINT PROBE METHOD; GALVANOSTATIC ELECTRODEPOSITION; SULFATE ELECTROLYTES; THIOUREA;

COPPER;

EID: 0035262727     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1342144     Document Type: Article

References (8)