Time development of microstructure and resistivity for very thin Cu films

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 20, Issue 6, 2002, Pages 1911-1915

  Rossnagel, S M ^a   Kuan, T S ^b  

^a IBM RESEARCH   (United States)

^b STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AGGLOMERATION; ELECTRIC RESISTANCE; ELECTRODEPOSITION; MICROSTRUCTURE; SUBSTRATES; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

SURFACE PINNING EFFECT;

COPPER;

EID: 0036863268     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1507340     Document Type: Article

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