Investigations of effects of bias polarization and chemical parameters on morphology and filling capability of 130 nm damascene electroplated copper

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 19, Issue 3, 2001, Pages 767-773

  Chang, Shih Chieh ^b   Shieh, Jia Min ^a,b   Lin, Kun Cheng ^b   Dai, Bau Tong ^a,b   Wang, Ting Chun ^b   Chen, Chia Fu ^b   Feng, Ming Shiann ^b   Li, Ying Hao ^c   Lu, Chih Peng ^c  

^a NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^c Merck Kanto Advanced Chemicals Ltd   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTROLYTES; ELECTROPLATING; IONS; MORPHOLOGY; POLARIZATION;

ELECTROPLATED COPPER;

COPPER;

EID: 0035326276     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1368673     Document Type: Conference Paper

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