Analysis of stress and composition of silicon nitride thin films deposited by electron cyclotron resonance plasma-enhanced chemical vapor deposition for microfabrication processes

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 23, Issue 1, 2005, Pages 168-172

  Cianci, E ^a   Pirola, F ^a   Foglietti, V ^a  

^a IFN CNR   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; DEPOSITION; ELECTRON CYCLOTRON RESONANCE; HELIUM; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; STRESS ANALYSIS; TENSILE STRESS; THIN FILMS;

INTRINSIC STRESSES; PROCESS PARAMETERS;

SILICON NITRIDE;

EID: 31144461355     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1835316     Document Type: Article

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