Microfabrication and application of high-aspect-ratio silicon tips

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 23, Issue 4, 2005, Pages 1582-1584

  Wang, Yaqiang ^a   Van Der Weide, Daniel W ^a  

^a Wisconsin Electric Machines and Power Electronics Consortium   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CANTILEVERS; HIGH-ASPECT-RATIO (HAR); REACTIVE ION ETCHING (RIE);

ASPECT RATIO; ATOMIC FORCE MICROSCOPY; ETCHING; FABRICATION;

SILICON;

EID: 31144460444     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1947805     Document Type: Article

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