Effects of temperature profile on the life prediction of PBGA solder joints under thermal cycling

Key Engineering Materials

Volumn , Issue 149 PART II, 1998, Pages 1133-1138

  Zhang, X W ^a   Lee, S W R ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Plastic Ball Grid Array; Solder Joint Reliability; Steady State Creep; Thermal Fatigue Life Prediction

Indexed keywords

EID: 0041012853     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Article

References (10)

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10. H. D. Solomon, IEEE Trans. Comp., Hybrids, Manf. Technol, Vol. CHMT-9, No. 4, Dec. 1986, pp. 423-432.