Solder reliability solutions: from LCCCS to area-array assemblies

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 3, Issue , 1996, Pages 1665-1680

  Clech, Jean Paul M ^a  

^a EPSI Inc

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; COMPUTER AIDED DESIGN; COMPUTER AIDED MANUFACTURING; COMPUTER SIMULATION; DATABASE SYSTEMS; FINITE ELEMENT METHOD; PERSONAL COMPUTERS; PLASTICS APPLICATIONS; RELIABILITY; SOLDERED JOINTS; SOLDERING; SURFACE MOUNT TECHNOLOGY;

AREA ARRAY ASSEMBLY; BALL GRID ARRAY; CHIP SCALE PACKAGING; DESIGN PARAMETERS; SOLDER INTERCONNECTS; SOLDER RELIABILITY SOLUTIONS; THERMAL EXPANSION COEFFICIENT;

ELECTRONICS PACKAGING;

EID: 0029708667     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (53)