Characterization and thermal stability of fluorosilicate glass films deposited by high density plasma chemical vapor deposition with different bias power

Thin Solid Films

Volumn 498, Issue 1-2, 2006, Pages 289-293

  Hsiao, Wen Chu ^a   Liu, Chuan Pu ^a   Wang, Ying Lang ^b   Cheng, Yi Lung ^c  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL UNIVERSITY OF TAINAN   (Taiwan)

^c NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Bias power; High density plasma (HDP) CVD; Stress hysteresis; Thermal desorption

Indexed keywords

ANNEALING; DIELECTRIC MATERIALS; FLUORINE COMPOUNDS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HYSTERESIS; MICROSTRUCTURE; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; THERMODYNAMIC STABILITY; THIN FILMS;

BIAS POWER; HIGH-DENSITY PLASMA (HDP) CVD; STRESS HYSTERESIS; THERMAL DESORPTION;

GLASS;

EID: 30944452374     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.07.129     Document Type: Conference Paper

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