Origin of intrinsic stress and its relaxation for SiOF thin films deposited by electron cyclotron resonance plasma-enhanced chemical vapor deposition

Thin Solid Films

Volumn 379, Issue 1-2, 2000, Pages 259-264

  Kim, S P ^a   Choi, S K ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; ELECTRON CYCLOTRON RESONANCE; FOURIER TRANSFORM INFRARED SPECTROSCOPY; ION BOMBARDMENT; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICON COMPOUNDS; STRESS RELAXATION; SUBSTRATES; THIN FILMS;

INTRINSIC STRESS; LOW DIELECTRIC MATERIALS;

DIELECTRIC FILMS;

EID: 0034503675     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(00)01399-7     Document Type: Article

References (20)

1. S. Wolf, Silicon Processing for VLSI Era, Vol. 2, Lattice Press, Sunset Beach, CA, 1990.
2. Tummala R.R. Microelectronics Packaging Handbook. 1989;Van Nostrand Reinhold, New York.
3. Yoo W.S., Swope R., Mordo D. Jpn. J. Appl. Phys. 36:1997;267.
4. Pankov V., Alonso J.C., Ortiz A. J. Appl. Phys. 86:1999;275.
5. Lee S., Kim D.J., Yang S.H., Park J., Sohn S., Oh K., Kim Y.T., Kim J.Y., Yeom G.Y., Park J.W. J. Appl. Phys. 85:1999;473.
6. Bazylenko M.V., Gross M., Simonian A., Chu P.L. J. Vac. Sci. Technol. A. 14:1996;336.
7. Robic J.Y., Leplan H., Pauleau Y., Rafin B. Thin Solid Films. 290-291:1996;34.
8. Desu S.B. Jpn. J. Appl. Phys. 30:1991;L2123.
9. Shintani A., Sugaki S., Nakashima H. J. Appl. Phys. 51:1980;4197.
10. Temple D., Reisman A., Fountain G.G., Walters M, Hattangady S.V. J. Electrochem. Soc. 140:1993;564.
11. Wu T.H.T., Rosler R.S. Solid State Technol. 35:1992;65.
12. Sinha A.K., Levinstein H.J., Smith T.E. J. Appl. Phys. 49:1978;2423.
13. Herak T.V., Thomson D.J. J. Appl. Phys. 67:1990;6347.
14. Tu K.N., Mayer J.W., Feldman L.C. Electronic Thin Film Science for Electrical Engineers and Materials Scientists. 1987;Macmillan, New York.
15. Chand N., Kola R.R., Opila R.L., Comizzoli R.B., Krautter H., Sergent A.M., Tsang W.T., Osenbach J.W., Luftman H.S. J. Appl. Phys. 78:1995;3315.
16. Pulker H.K., Maser J. Thin Solid Films. 59:1979;65.
17. Windischman H. Crit. Rev. Solid Stat. Mater. Sci. 17:1992;547.
18. Takahashi H., Nishiguchi A., Nagata H., Kataoka H., Fujishima M. J. Appl. Phys. 79:1996;2787.
19. Devine R.A.B. J. Non-Cryst. Solids. 152:1993;50.
20. Lehmann A., Schumann L., Hübner K. Phys. Stat. Solid B. 117:1983;689.