Surface treatment of wire bonding metal pads

Microelectronic Engineering

Volumn 70, Issue 2-4, 2003, Pages 558-565

  Alberici, S ^a   Coulon, D ^b   Joubin, P ^b   Mignot, Y ^b   Oggioni, L ^a   Petruzza, P ^a   Piumi, D ^a   Zanotti, L ^a  

^a STMICROELECTRONICS   (Italy)

^b STMICROELECTRONICS   (France)

Author keywords

Fluoride; Pad corrosion

Indexed keywords

CORROSION PROTECTION; CRYSTAL DEFECTS; PASSIVATION; SURFACE TREATMENT;

WIRE BONDING;

BONDING;

EID: 0142011562     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(03)00418-0     Document Type: Conference Paper

References (5)

1. Ernst K.-H., et al. Surf. Interface Anal. 21 (1994) 691.
2. Thomas J.H., et al. Surf. Interface Anal. 14 (1989) 39.
3. Grman D., et al. Solid State Technol. 35 (2) (1992) 43.
4. Linn J.H., Swartz W.E. Spectrosc. Lett. 18 (5) (1985) 335.
5. Chuang T.J., et al. Appl. Surf. Sci. 2 (1978) 514.