Stress induced diffusion along adhesional contact interfaces

Acta Materialia

Volumn 51, Issue 8, 2003, Pages 2219-2234

  Takahashi, Y ^a   Uesugi, K ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Adhesional contact; Bond strength; Gold wire; Interface self diffusion; Room temperature bonding; Stress relaxation; Surface energy; Transient behavior; Vacancy diffusion

Indexed keywords

ACTIVATION ENERGY; ADHESION; GOLD; INTERFACES (MATERIALS); INTERFACIAL ENERGY; RESIDUAL STRESSES; STRESS RELAXATION; WIRE;

ADHESIONAL CONTACT INTERFACES;

DIFFUSION;

EID: 0037425405     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(03)00015-6     Document Type: Article

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