Phase Transformations in Thermally Exposed Au-Al Ball Bonds

Journal of Electronic Materials

Volumn 33, Issue 4, 2004, Pages 340-352

  Noolu, Naren ^a,b   Murdeshwar, Nikhil ^c   Ely, Kevin ^d   Lippold, John ^a   Baeslack III, William ^e  

^a OHIO STATE UNIVERSITY   (United States)

^b UNIVERSITY OF WATERLOO   (Canada)

^c Kulicke and Soffa Industries   (United States)

^d EDISON WELDING INSTITUTE   (United States)

^e RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

Au Al; Ball bonds; Interdiffusion reactions; Intermetallics; Phase transformations; Thermal exposure

Indexed keywords

CHEMICAL BONDS; CRACK PROPAGATION; DIFFUSION; GOLD COMPOUNDS; METALLIZING; MICROSTRUCTURE; PHASE TRANSITIONS; THIN FILMS;

INTERDIFFUSION REACTIONS; LATERAL GROWTH; REVERSE TRANSFORMATIONS; THERMAL EXPOSURE;

INTERMETALLICS;

EID: 2342530456     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0141-7     Document Type: Article

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