Oxidation of bulk Au-Al intermetallics

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 357-362

  Xu, C ^a   Breach, C D ^b   Sritharan, T ^a   Wulff, F ^b   Mhaisalkar, S G ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b Kulicke and Soffa SEA Pte Ltd   (Singapore)

Author keywords

Gold aluminides; Gold ballbonds; Oxidation; TGA

Indexed keywords

ALLOY PAD METALLIZATION; BALLBOND OXIDATION; GOLD BALLBONDS;

ALUMINUM; BONDING; CONTAMINATION; CORROSION; ELECTRONICS PACKAGING; GOLD; OXIDATION; THERMOGRAVIMETRIC ANALYSIS;

INTERMETALLICS;

EID: 4444271682     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.041     Document Type: Article

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