Reliability aspects of stress-induced voiding in 0.25 μm metallization

International Integrated Reliability Workshop Final Report

Volumn , Issue , 1999, Pages 10-13

  Zitzelsberger, Anke ^a   Lehr, Mathias ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CURRENT DENSITY; DEPOSITION; ELECTROMIGRATION; FAILURE ANALYSIS; METALLIZING; PLASMAS; RELIABILITY; STRESS ANALYSIS; TITANIUM COMPOUNDS;

MEDIAN TIME TO FAILURE (MTF); STRESSMIGRATION (SM);

INTERCONNECTION NETWORKS;

EID: 0033282272     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)