Quantitative study of void nucleation times in passivated aluminum interconnects

Materials Research Society Symposium - Proceedings

Volumn 516, Issue , 1998, Pages 83-88

  Doan, Jonathan C ^a   Bravman, John C ^a   Flinn, Paul A ^a   Marieb, Thomas N ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CURRENT DENSITY; ELECTROMIGRATION; FAILURE ANALYSIS; FRACTURE MECHANICS; NUCLEATION; PASSIVATION;

ACCELERATED ELECTROMIGRATION TESTS;

SEMICONDUCTOR DEVICE TESTING;

EID: 0032310046     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)