Characterization of thermal stresses of Cu/low-k submicron interconnect structures

Proceedings of the IEEE 2001 International Interconnect Technology Conference, IITC 2001

Volumn , Issue , 2001, Pages 89-91

  Rhee, Seung Hyun ^a   Du, Yong ^a   Ho, P S ^a  

^a The University of Texas at Austin   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 85001136039     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2001.930026     Document Type: Conference Paper

References (12)

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