The effect of low-kild on the electromigration reliability of Cu interconnects with different line lengths

IEEE International Reliability Physics Symposium Proceedings

Volumn 2003-January, Issue , 2003, Pages 173-177

  Hau Riege, Christine S ^a   Marathe, Amit P ^a   Pham, Van ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

Blech effect; Cu low k; Electromigration; Immortality

Indexed keywords

RELIABILITY; SENSITIVITY ANALYSIS;

BLECH EFFECT; CU-INTERCONNECTS; CU/LOW-K; ELECTROMIGRATION PARAMETERS; ELECTROMIGRATION RELIABILITY; IMMORTALITY; LOW-K MATERIALS; PROCESS VARIATION;

ELECTROMIGRATION;

EID: 84955249439     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2003.1197740     Document Type: Conference Paper

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