The influence of the package environment on the functioning and reliability of capacitive RF-MEMS switches

Microwave Journal

Volumn 48, Issue 12, 2005, Pages 102-116

  De Wolf, Ingrid ^a   Czarnecki, Piotr ^a   Jourdain, Anne ^a   Modlinski, Robert ^a   Tilmans, Harrie A C ^a   Puers, Robert ^b   Van Beek, Joost T M ^c   Van Merlijn Spengen, W ^d  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

^d LEIDEN UNIVERSITY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

MECHANICAL STRESSES; MEMS;

ELECTRIC INSULATORS; ELECTRONICS PACKAGING; RELIABILITY; SWITCHES; VIBRATION MEASUREMENT;

MICROELECTROMECHANICAL DEVICES;

EID: 30344479820     PISSN: 01926225     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

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