A reliable and compact polymer-based package for capacitive RF-MEMS switches

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 2004, Pages 31-34

  Oya, Y ^b   Okubora, A ^b   Van Spengen, M ^a   Soussan, P ^a   Stoukatch, S ^a   Rottenberg, X ^a   Ratchev, P ^a   Tilmans, H ^a   De Raedt, W ^a   Beyne, E ^a   De Moor, P ^a   De Wolf, I ^a   Baert, K ^a  

^a IMEC   (Belgium)

^b SONY CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC HUMIDITY; CAPACITANCE; ELECTRIC SWITCHES; ELECTRONICS PACKAGING; INSERTION LOSSES; LAMINATES; NATURAL FREQUENCIES; STRENGTH OF MATERIALS; THICKNESS MEASUREMENT; PACKAGING;

LAMINATE SUBSTRATES; THERMAL BUDGETS; WAFER SINGULATION; WAFER-LEVEL;

MICROELECTROMECHANICAL DEVICES; ELECTRIC SWITCHES;

ACCELERATED LIFETIME TESTING; CAPACITIVE RF MEMS SWITCH; CAPACITIVE SWITCH; HIGH MECHANICAL STRENGTH; LAMINATE SUBSTRATES; PACKAGING EQUIPMENT; POLYMER BASED PACKAGES; SEALED GLASS;

EID: 17444379828     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. G. Riley, "Wafer-level hermetic packaging," Advanced Packaging, May 2004.
2. H. Tilmans e.a, "Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab" Proc. IEEE International Electron Devices Meeting (IEDM)., Washington, DC, Dec. 3-5 2001 pp. 921-924.
3. A. Jourdain, X. Rottenberg, G. Carchon and H. Tilmans "Optimisation of 0-level packaging for RF-MEMS devices," Proc. Transducers 03 Conf, Boston, June 9-12, pp 1915-1918.
4. S.Stoukatch, T.Webers, C.Winters, K.Baert and E.Beyne "Thermocompression Flip Chip bonding using gold ball bumps for RF and MEMs Applications," Proc. 15th Eur. Microelectronics and Packaging Conference, Prague, Czech Rep., pp.163-168, June 16-18, 2004.
5. nd Eur. Microwave Conf., Milan, Italy, 23-27 Sept. 2002, pp 809-812.
6. W. Van Spengen, B. Puers R. Mertens and I. De Wolf, "A low frequency electrical test set-up for the reliability assessment of capacitive RF MEMS switches". J. Micromech. Microeng. 13, p. 604, 2003.
7. W. Van Spengen, R. Puers, R. Mertens and I. De Wolf, "Experimental characterization of stiction due to charging in RF MEMS" Proc. IEEE International Electron Devices Meeting (IEDM), San Francisco, California, Dec. 8-11, 2002, pp 901-904.
8. I. De Wolf, "The reliability of RF-MEMS: failure modes, test procedures ad instrumentation," Proc. SPIE Vol. 5343, Reliability, testing and characterization of MEMS/MOEMS, San Jose, California, Jan. 24-29, 2004, pp 1-8.