How reflow temperatures affect BGA delamination: An experiment seeks to evaluate two commonly used soldering methods and nine temperature profiles to understand their impact

SMT Surface Mount Technology Magazine

Volumn 13, Issue 2, 1999, Pages 154-157

  Huang, Yizhe Elisa ^a   Hagen, Debbie ^a   Dody, Glenn ^a   Burnette, Terry ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; DELAMINATION; ELECTRONICS PACKAGING; HEAT CONVECTION; THERMAL EFFECTS; VAPORIZATION;

PLASTIC BALL GRID ARRAYS (PBGA);

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0033077566     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. C. Beddingfield and L. Higgins, "Moisture Sensitivity and Component Reliability of Flip Chip PBGA Assemblies," 1996 IEPS Proceedings of the Technical Conference, p. 26.
2. R. Munamarty and P. McCluskey, "Popcorning in Fully Populated and Perimeter Plastic Ball Grid Array Packages," Solder & Surface Mount Technology, Issue 22, 1996, p. 46-50.
3. G. Ganesan and H. Berg, "Model and Analyses for Solder Reflow Cracking Phenomenon in SMT Plastic Packages," ECTC IEEE/CHMT Journal, 1993.
4. R. Tummala, Microelectronics Packaging Handbook, 1989.
5. J. Hwang, Modern Solder Technology for Competitive Electronics Manufacturing, 1996.