SCOPUS 정보 검색 플랫폼

Volumn 25, Issue 2, 2002, Pages 301-308

A simple model for the Mode I popcorn effect for IC packages with copper leadframe

a IEEE (Germany)

Author keywords

Electronic packaging; Estimation of moisture level; Moisture sensitivity; Package stability; Popcorn effect

Indexed keywords

MOISTURE SENSITIVITY;

COPPER; DIES; ELECTRONICS PACKAGING; MATHEMATICAL MODELS; MOISTURE DETERMINATION; MOLDING; SENSITIVITY ANALYSIS; SOLDERING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0036613227 PISSN: 15213331 EISSN: None Source Type: Journal
DOI: 10.1109/TCAPT.2002.1010021 Document Type: Article

Times cited : (13)

References (17)

1
- 0032230764
- Investigation of the adhesion strength between MC and leadframe at higher temperatures
- (1998) Proc. IEEE/EPTC'98 Conf. , pp. 349-353
- Schmidt, R.¹ Alpern, P.² Plecher, K.³ Tilgner, R.⁴

2
- 0022183127
- Moisture resistance degradation of plastic LSI's by reflow soldering
- (1985) Proc. IEEE/IRPS'85 Conf. , pp. 192-197
- Fukuzawa, I.¹ Ishiguro, S.² Nabu, S.³

3
- 0026366856
- Causes of cracks in SMD and type specific remedies
- Dec.
- (1991) IEEE Trans. Comp. Hybrids, Manufact. Tehnol. , vol.14 , pp. 818-823
- Omi, S.¹ Fujita, K.² Tsuda, T.³ Maeda, T.⁴

4
- 0023861977
- Analysis of package cracking during the reflow soldering process
- (1988) Proc. IEEE/1RPS'88 Conf. , pp. 90-95
- Kitano, M.¹ Nishimura, A.² Kawai, S.³ Nishi, K.⁴

5
- 0031632977
- Moisture diffusion and vapor pressure modeling of IC Packaging
- (1998) Proc. Electron. Comp. Technol. Conf. (ECTC'98) , pp. 1372-1378
- Wong, E.H.¹ Teo, Y.C.² Lim, T.B.³

6
- 0027166635
- Model and analyzes of solder reflow cracking phenomenon in SMT plastic packages
- (1993) Proc. IEEE 43rd Electron. Comp. Technol. Conf. , pp. 653-660
- Ganesan, G.S.¹ Berg, H.M.²

7
- 0032230453
- Vapor pressure analysis of IC packages by fracture mechanics
- (1998) Proc. IEEE/CPMT Electron. Packag. Technol. Conf. , pp. 36-42
- Lim, J.H.¹ Lee, K.W.² Park, S.S.³ Earmme, Y.Y.⁴

8
- 0004020231
- New York: Oxford Univ. Press
- (1975) The Mathematics of Diffusion, 2nd ed.
- Crank, J.¹

10
- 0030395399
- Thick plastic packages with small chips vs thin packages with large chips: How different is their propensity to moisture-induced failures?
- E. Suhir, Ed. New York: ASME
- (1996) Structural Analysis in Microelectronics and Fiber Optics , vol.EEP-16 , pp. 101-125
- Suhir, E.¹ Ilyas, Q.S.M.²

11
- 0027577946
- Sorption of water and organic solutes in polyimide films and its effects on dielectric properties
- (1993) J. Polym. Phys. , vol.31 , pp. 545-555
- Lim, B.S.¹ Nowick, A.S.² Lee, K.W.³ Viehbeck, A.⁴

12
- 0031234029
- Moisture absorption and desorption predictions for plastic ball grid array packages
- Sept.
- (1997) IEEE Trans. Comp., Packag., Manufact. Technol. A , vol.20 , pp. 274-279
- Galloway, J.E.¹ Miles, B.M.²

13
- 0030649127
- Influence of preheat and maximum temperature of the solder-reflow profile on moisture sensitive ICs
- (1997) Proc. 47th Electron. Comp. Technol. Conf. , pp. 1041-1048
- Shook, R.L.¹ Sastri, V.S.²

14
- 0009967047
- Mar.
- (2002) IEEE Trans. Comp. Packag. Technol. , vol.25 , pp. 56-65

15
- 84866572897
- Fraunhofer Institute IZM, Department Mechanical Reliability and Micro Materials, personal communication, Berlin, Germany
- Dudek, R.¹ Döring, R.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.