SCOPUS 정보 검색 플랫폼

Volumn 25, Issue 1, 2002, Pages 56-65

On the mode II popcorn effect in thin packages

a IEEE

Author keywords

Electronic packaging; Mode II popcorn effect; Moisture sensitivity

Indexed keywords

COMPUTER SIMULATION; CRACK PROPAGATION; DIFFUSION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MOISTURE; THERMAL EFFECTS;

CRITICAL DOMING ANGLE;

ELECTRONICS PACKAGING;

EID: 0036505718 PISSN: 15213331 EISSN: None Source Type: Journal
DOI: 10.1109/6144.991176 Document Type: Article

Times cited : (16)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.