Handling of highly-moisture sensitive components - an analysis of low-humidity containment and baking schedules

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 23, Issue 2, 2000, Pages 81-86

  Shook, Richard L ^a   Goodelle, Jason P ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; MOISTURE CONTROL;

MOISTURE DIFFUSION;

SURFACE MOUNT TECHNOLOGY;

EID: 0034172093     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.846930     Document Type: Article

References (10)

1. Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices, J-STD-020A, 1999.
2. C. Grosskopt, "Moisture/reflow sensitivity," Future Circuits Int., vol. 3, pp. 27-35, 1998.
3. P. Melville, "Moisture sensitivity ratings for SMT packages," Surface Mount Technol, pp. 49-53, Sept. 1994.
4. Procedures for Characterizing and Handling of Moisture/Reflow Sensitive 1C 's, IPC-SM-786A, 1995.
5. J. Crank and G. S. Park, Diffusion in Polymers. London, U.K.: Academic, 1968.
6. M. Kitano, A. Nishimura, S. Kawai, and K. Nishi, "Analysis of package cracking during reflow soldering process," Proc. Int. Ret. Phys. Symp., pp. 90-95, 1988.
7. R. Shook, T. Conrad, V. Sastry, and D. Steele, "Diffusion model to derate moisture sensitive surface mount 1C's for factory use conditions," Proc. 46th Electron. Comp. Technol. Conf., 1995, pp. 440-449.
8. R. Shook, B. Vaccaro, and D. Gerlach, "Method for equivalent acceleration of JEDEC/IPC moisture sensitivity levels," Proc. Int. Rel. Phys. Symp., 1998, pp. 214-219.
9. L Crank, The Mathematics of Diffusion. Oxford, U.K.: Oxford Univ.Press, 1979.
10. H. S. Carslaw and J. C. Jaeger, Conduction of Heat in Solids. Oxford, U.K.: Oxford Univ. Press, 1980.