Properties of molding compounds to improve package reliability of SMD's

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 4, 1999, Pages 534-540

  Tada, Kazuhiro ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC HUMIDITY; CRACK INITIATION; CROSSLINKING; EPOXY RESINS; GLASS TRANSITION; HEAT RESISTANCE; PLASTICS MOLDING; RELIABILITY; SOLDERING; SURFACE MOUNT TECHNOLOGY;

HUMIDITY RESISTANCE; PACKAGE CRACKING RESISTANCE;

ELECTRONICS PACKAGING;

EID: 0033311124     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.814969     Document Type: Article

References (10)

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3. A. A. Gallo and T. R. Tubbs High solder-reflow crack resistant molding compound IEEE Comp. Packag. Manufact. Technol. A vol. 18. pp. 646-649 Sept. 1995.
4. H. Lee and Y. Y. Earmme A fracture mechanics analysis of the effects of material properties and geometries of components on various types of package cracks IEEE Comp. Packag. Manufact. Technol. A vol. 19. pp. 168-178 Jun. 1996.
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9. S. S. Ahmad R. C. Blish T. J. Corbett J. L. King and C. G. Shirley Effect of bromine in molding compounds on gold-aluminum bonds IEEE Comp. Hybrids Manufact. Technol. vol. CHMT-9 pp. 379-385 Dec. 1986.
10. M. Ochi T. Tsuboi H. Kageyama and M. Shimbo Internal stress in epoxy resin networks including naphthalene structure J. Adhes. Soc. Japan vol. 25 pp. 222-227 1989.