Oxidation control of copper leadframe package for prevention of popcorn cracking

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 78-83

  Takano, Eiji ^a   Mino, Toshikazu ^a   Takahashi, Kenji ^a   Sawada, Kanako ^a   Shimizu, Shin ya ^a   Yoo, Hee Yeoul ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER ALLOYS; CRACKS; FILM GROWTH; OXIDATION; PLASTIC FILMS; RELIABILITY; SHEET MOLDING COMPOUNDS; SOLDERING; THERMAL EFFECTS;

OXIDE FILMS; POPCORN CRACKING;

ELECTRONICS PACKAGING;

EID: 0030678345     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)