Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow process

Microsystem Technologies

Volumn 10, Issue 5, 2004, Pages 364-371

  Rusu, C ^b   Jansen, H ^c   Gunn, R ^d   Witvrouw, A ^a,b  

^a IMEC   (Belgium)

^b Imego AB The Institute of Micro and Nanotechnology   (Sweden)

^c UNIVERSITY OF TWENTE   (Netherlands)

^d Surface Technology Systems Plc   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BONDING; CHEMICAL VAPOR DEPOSITION; CMOS INTEGRATED CIRCUITS; COSTS; FUSED SILICA; MICROMACHINING; MICROPROCESSOR CHIPS; PACKAGING; THIN FILMS; VACUUM;

LOW PRESSURE CHEMICAL VAPOR DEPOSITION (LPCVD); MICROMACHINED MEMBRANES; WAFER BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 4644241119     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-004-0415-2     Document Type: Conference Paper

References (6)

1. Tilmans HAC; Van de Peer MDJ; Beyne E (2000) The intend reflow sealing (IRS) technique-a method for fabrication of sealed cavities for MEMS devices. J MEMS 9: 206-217
2. Partridge A; Rice AE; Kenny TW; Lutz M (2001) New thin film epitaxial polysilicon encapsulation for piezoresistive accelerometers. Proc. MEMS 54-59
3. Rusu Q Verbist A; Parmentier B; Witvrouw A (2002) MEMS 0-level packaging using thin-film poly-SiGe caps. Proc. MEMS workshop of International Microelectronics and packaging Society (IMAPS), Sept 6-8, Denver, USA
4. Legtenberg R; Tilmans HAC (1994) Electrostatically driven vacuum encapsulated polysilicon resonators, Part I: Design and fabrication. Sensors and Actuators A 45, p. 57-66
5. Liu C; Tai YC (1999) Sealing of micromachined cavities using chemical vapor deposition methods: characterisation and optimization. J MEMS 8:135-145
6. Rusu C; Klaasse G; Sedky S; Esch H; Parmentier B; Verbist A; Witvrouw A (2001) Planarization of deep trenches. Proc. SPIE Micromachining and Microfabrication Process technology VII, 22-24 Oct. San Francisco, CA, USA, pp. 49-57