Wafer level micropackaging of MEMS devices using thin film anodic bonding

Materials Research Society Symposium - Proceedings

Volumn 729, Issue , 2002, Pages 229-234

  Rohwer, Lauren E S ^a   Oliver, Andrew D ^a   Collins, Melissa V ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); MICROACTUATORS; MICROELECTROMECHANICAL DEVICES; MICROSCOPIC EXAMINATION; SHEAR STRENGTH; THERMAL EFFECTS; THIN FILMS; VACUUM APPLICATIONS;

ANODIC BONDING; MICROENERGIES; SCANNING ACOUSTIC MICROSCOPY; SURFACE MICROMACHINED POLYSILICON DEVICES; THERMAL ACTUATORS; TORSIONAL RATCHETING ACTUATORS; WAFER LEVEL MICROPACKAGING;

SILICON WAFERS;

EID: 0036929055     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: 10.1557/proc-729-u5.7     Document Type: Article

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