A novel device-level micropackaging using micro assembly transfer

American Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS)

Volumn 3, Issue , 2001, Pages 769-774

  Chen, Jen Yi ^a   Huang, Long Sun ^a   Chu, Chia Hua ^a   Kuo, Yao Hui ^a   Chang, Peizen ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CONTAMINATION; ELECTROPLATING; GLASS; INTEGRATED CIRCUITS; MICROMACHINING; NUMERICAL ANALYSIS; PACKAGING; Q FACTOR MEASUREMENT; STRESS CONCENTRATION;

MICRO ASSEMBLY TRANSFER; MICROPACKAGING;

MICROELECTROMECHANICAL DEVICES;

EID: 1542642421     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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