Electrochemical behavior of bis(β-diketonate)copper complexes

Journal of the Electrochemical Society

Volumn 152, Issue 11, 2005, Pages

  Denison, Ginger M ^a   Evans, Amber O ^b   Bessel, Carol A ^c,f   Skaf, Dorothy W ^d   Murray, Royce W ^a,f   DeSimone, Joseph M ^a,e  

^a University of North Carolina at Chapel Hill   (United States)

^b NORTH CAROLINA A AND T STATE UNIVERSITY   (United States)

^c VILLANOVA UNIVERSITY   (United States)

^d Villanova University   (United States)

^e North Carolina State University   (United States)

^f ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

COMPLEXATION; COPPER COMPOUNDS; CORROSION; DEPOSITION; INTEGRATED CIRCUIT MANUFACTURE; IONIC STRENGTH; MICROPROCESSOR CHIPS; PASSIVATION; PH EFFECTS; SOLUTIONS;

BUFFER SOLUTIONS; COPPER COMPLEXES; EQUILIBRIUM CONSTANTS; INTERCONNECTS;

ELECTROCHEMISTRY;

EID: 27944499449     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2047387     Document Type: Article

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