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Thin Solid Films

Volumn 394, Issue 1-2, 2001, Pages 179-187

A comparative study of sputtered TaCx and WCx films as diffusion barriers between Cu and Si

(3) Wang, Shui Jinn a Tsai, Hao Yi a Sun, S C b

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

b Research and Development (United States)

Author keywords

Cu diffusion; Diffusion barrier; Tantalum carbide; Tungsten carbide

Indexed keywords

COPPER; DIFFUSION; SILICON; SPUTTERING; SUBSTRATES; TANTALUM CARBIDE; THERMODYNAMIC STABILITY; TUNGSTEN CARBIDE;

DIFFUSION BARRIERS;

THIN FILMS;

EID: 0035882149 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/s0040-6090(01)01173-7 Document Type: Article

Times cited : (12)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.