Degradation of Sn-Ag-Cu heat-sink attachment during thermal shock cycling

Soldering and Surface Mount Technology

Volumn 17, Issue 4, 2005, Pages 10-16

  Chang, Junling ^a,b   Janz, Dirk ^b,d   Kempe, W ^c   Xie, Xiaoming ^a,b,e,f  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b DaimlerChrysler SIM Technology Co Ltd   (China)

^c DAIMLER AG   (Germany)

^d Continental Temic Microelectronics ^*  (Germany)

^e China Electronics Institute   (China)

^f Packaging Branch   (China)

Author keywords

Failure (mechanical); Fatigue; Product reliability; Solder; Soldering

Indexed keywords

DYE PENETRATION; INTERFACE DELAMINATION; PRODUCT RELIABILITY; THERMAL SHOCK;

COPPER; DELAMINATION; HEAT SINKS; RELIABILITY; SILVER; THERMAL EFFECTS; TIN;

SOLDERED JOINTS;

EID: 27644577763     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910510630386     Document Type: Article

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