Thermal-mechanical interface crack behaviour of a surface mount solder joint

Finite Elements in Analysis and Design

Volumn 30, Issue 1-2, 1998, Pages 19-30

  Wu, C M L ^a   Lai, J K L ^a   Wu, Yong Li ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b INSTITUTE OF MECHANICS   (China)

Author keywords

Finite element analysis; Interface crack; J integral; Lead tin solder joint; Thermal mechanical analysis

Indexed keywords

CRACK PROPAGATION; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); STRESS ANALYSIS; SURFACE PHENOMENA; THERMAL STRESS;

INTERFACE CRACKS;

SOLDERED JOINTS;

EID: 0032117141     PISSN: 0168874X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-874X(98)00028-6     Document Type: Article

References (21)

1. T.R. Homa, Cracking of electronic packaging joints due to creep-fatigue, in: Proc. ASM's 3rd Conf. on Electronic Packaging and Corrosion in Microelectronics, 1987, pp. 209-216.
2. W. Engelmaier, Effects of power cycling on leadless chip carrier mounting reliability and technology, Electronic Packaging and Production (1983) 58-63.
3. J.T. Lynitt, M.R. Ford, A. Boetti, The effect of high dissipation components on the solder joints of ceramic chip carriers attached to thick film alumina substrates, IEEE Trans. Components, Hybrids, Manuf. Technol. 6 (1983) 237-245.
4. J.M. Montante, D.R. Kling, High reliability attachment of multilayer chip carriers to ceramic substrates for the class S environment, in: Proc. Electronic Components Conf., 1984, pp. 129-137.
5. D.L. Hallowell, D.W. Kellerman, Analysis of a stacked thick film package, in: Proc. Int. Microelectronics Symp. 1984, pp. 281-292.
6. H. Danielsson, Chip carner on ceramic thick film multilayer boards in high reliability applications, in: Proc. Int. Microelectronics Symp. 1984, pp. 56-60.
7. D.E. Riemer, C.W. Saulsberry, Power cycling of ceramic chip carriers on ceramic substrates (an analysis of test results), in: Proc. Int. Microelectronics Symp., 1984, pp. 480-485.
8. G.V. Clatterbaugh, H.K. Charles, Jr., Thermomechanical behaviour of soldered interconnects for surface mounting: a comparison of theory and experiment, in: IEEE Proc. 34th Electronic Components Conf., 1985, pp. 60-72.
9. J.H. Lau, D.W. Rice, P.A. Avery, Elastoplastic analysis of surface-mount solder joints, IEEE Trans. Components Hybrids, Manuf. Technol. 10 (1987) 346-357.
10. S.E. Yamada, Elastic/plastic fracture analysis for bonded joints, Eng. Fracture Mech. 27 (1987) 315-328.
11. S.E. Yamada, Time dependent crack growth in soldered joint, Eng. Fracture Mech. 28 (1987) 85-91.
12. S.E. Yamada, A fracture mechanics approach to soldered joint cracking, in: IEEE Transs, Components Hybrids, Manuf. Technol. 12 (1989) 99-104.
13. R.R. Klod Kokini, Reynolds, Transient heating vs cooling of interfacial cracks in ceramic-to-metal bonds, Eng. Fracture Mech. 38 (1991) 371-383.
14. J.R. Rice, Elastic fracture concepts for interface cracks, J. Appl. Mech. Trans. ASME 55 (1988) 98-103.
15. J.R. Rice, A path independent integral and the approximate analysis, J. Appl. Mech. Trans. ASME 35 (1968) 379-386.
16. R.E. Smelser, M.E. Gurtin, On the J-integral for bimaterial bodies, Int. J. Fracture 13 (1977) 382-384.
17. S.E. Yamada, The J-integral for augmented double cantilever beams and its application to bonded joints, Eng. Fracture Mech. 29 (1988) 673-682.
18. J.A. King, Material Handbook for Hybrid Microelectronics, Artech House, Boston, 1988.
19. D.J. Dean, Thermal Design of Electronic Circuit Boards and Packages, Electrochemical Publications, 1985.
20. ABAQUS User's Manual, Hibbitt, Karlsson and Sorensen Inc., Providence, 1993.
21. D.R.J. Owen, A.J. Fawkes, Engineering Fracture Mechanics: Numerical Methods and Applications, Pineridge Press, Swansea, UK, 1983.