Modelling thermal effects of large contiguous voids in solder joints

Microelectronics Journal

Volumn 30, Issue 11, 1999, Pages 1115-1123

  Ciampolini, L ^a   Ciappa, M ^a   Malberti, P ^a   Regli, P ^a   Fichtner, W ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COMPUTER SIMULATION; HEAT RESISTANCE; HEAT TRANSFER; MATHEMATICAL MODELS; TEMPERATURE; THERMAL CONDUCTIVITY; THERMAL EFFECTS; THERMOANALYSIS; THERMOGRAPHY (IMAGING); THICKNESS MEASUREMENT;

CONTIGUOUS VOIDS; JUNCTION TEMPERATURE DISTORTION; THERMAL SIMULATIONS; X RAY INSPECTION;

SOLDERED JOINTS;

EID: 0033359412     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(99)00073-7     Document Type: Article

References (18)

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