Voiding mechanism in BGA assembly

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 3, 1996, Pages 190-198

  O'Hara, Wanda B ^a   Lee, Ning Cheng ^a,b,c,d  

^a INDIUM CORPORATION   (United States)

^b UNIVERSITY OF AKRON   (United States)

^c NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^d R and D Indium Corp of America ^*

Author keywords

BGA; Flux exclusion rate; Soldering; Viscosity; Void; Volatility

Indexed keywords

ASSEMBLY; DEFECTS; MATHEMATICAL MODELS; MOLTEN MATERIALS; PRINTED CIRCUIT BOARDS; SOLDERING; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; TEMPERATURE; TIN ALLOYS; VISCOSITY; WELDS;

BALL GRID ARRAY ASSEMBLY; MOLTEN SOLDERS; REFLOW TEMPERATURE; SOLDER BUMPS; SOLDERABILITY; SOLDERING MATERIALS; VISCOSITY DICTATED FLUX EXCLUSION RATE MODEL; VOIDING MECHANISM; VOLATILITY;

ELECTRONICS PACKAGING;

EID: 0030245312     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. D. T. Novick, "A Metallurgical Approach to Cracked Joints," Welding J. Res. Suppl., Vol. 52, No. 4, pp. 154S-158S, 1973.
2. . A. der Marderosian and V. Gionet, "The Effects of Entrapped Bubbles in Solder for The Attachment of Leadless Ceramic Chip Carriers," Proc. 21st IEEE International Reliability Physics Symposium, Phoenix, Arizona, pp. 235-241, 1983.
3. V. Tvergaard, "Material Failure by Void Growth to Coalescence," Advances in Applied Mechanics, Vol. 27, Pergamon Press, pp. 83-149, 1989.
4. M. Mahalingham, M. Nagarkar, L. Lofgran, J. Andrews, D. R. Olsen, and H. M. Berg, "Thermal Effects of Die Bond Voids in Metal, Ceramics and Plastic Packages," Proc. 34th IEEE Electronic Components Conference, New Orleans, Louisiana, pp. 469-477, 1984.
5. W. B. Hance and N.-C. Lee, "Formation and Control of Voiding in SMT," Proc. of 1992 ISHM, San Francisco, California, pg. 535, 1992.
6. P. A. Jaeger and N.-C. Lee, "A Model Study of Low Residue No Clean Solder Paste," Proc. of 1992 Nepcon West, Anaheim, California, pp. 394-404, 1992.