Reliability of plastic ball grid array package

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 1, 2002, Pages 73-77

  Sawada, Yuko ^a   Yamaguchi, Akihiko ^a   Oka, Seiji ^a   Fujioka, Hirofumi ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

Adhesion strength; Delamination; Moisture absorption; Package reliability; PBGA; PWB; Reflow; Soldering; Vapor pressure

Indexed keywords

ADHESION; CRACK PROPAGATION; DELAMINATION; DURABILITY; ELECTRONICS PACKAGING; EPOXY RESINS; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); MOISTURE; MOLDING; RELIABILITY; SOLDERING; STRESS ANALYSIS; THERMAL CYCLING; THERMOMECHANICAL TREATMENT; VAPOR PRESSURE;

PLASTIC BALL GRID ARRAY (PBGA) PACKAGE;

CHIP SCALE PACKAGES;

EID: 0036505740     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.991178     Document Type: Article

References (6)

1. Moisture absorption and desorption predictions for plastic ball grid array packages
2. Moisture sensitivity evaluation of ball grid array packages
3. Reliability assessment of BGA packages
4. Moisture diffusion and heat transfer in plastic IC packages
5. Finite element viscoelastic analysis of temperature and moisture effects in electronic packaging
6. Generation mechanism of initial delamination on pop corn phenomena of SMDs