A non-destructive visual failure analysis technique for cracked BGA interconnects

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 886-890

  Bragg, Jason ^a   Bookbinder, Justine ^a   Sanders, George ^a   Harper, Blake ^a  

^a Celestica Inc   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; DEFECTS; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FRACTURE; INSPECTION; INTEGRATED CIRCUIT MANUFACTURE; INTERFACES (MATERIALS); NONDESTRUCTIVE EXAMINATION; PRINTED CIRCUIT BOARDS; SOLDERING; SUBSTRATES;

BALL GRID ARRAYS; MECHANICALLY FRACTURING INTERCONNECTS; VISUAL INSPECTION;

OPTICAL INTERCONNECTS;

EID: 0038688981     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Chan, Y.C., et al, "Endoscopic Inspection of Solder Joint Integrity in Chip Scale Packages," Proc 50th EC & TC, Las Vegas, NV, May 2000, pp.569-575.
2. Ross, G. "Achieving 3D Inspection Under Low-Clearance BGAs," Proc APEX 2001, San Diego, CA, January 2001, pp.354-360.
3. Goyal, D., et al, "Failure Mechanism of Brittle Solder Joint Fracture in the Presence of ENIG Interface," Proc 52nd EC & TC, San Diego, CA, May. 2002, pp. 732-739.