Thermomechanical behavior of BGA solder joints under vibrations: an experimental observation

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 349-355

  Zhao, Y ^a   Basaran, C ^a   Cartwright, A ^a   Dishongh, T ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; ELASTICITY; ELECTRODYNAMICS; INTERFEROMETRY; SOLDERED JOINTS; STRESSES; SURFACES; THERMAL EFFECTS; THERMODYNAMIC PROPERTIES;

BALL GRID ARRAY SOLDER JOINT; CONCURRENT LOADING; ELECTRODYNAMIC SHAKER; LASER MOIRE INTERFEROMETRY; THERMOMECHANICAL BEHAVIOR;

ELECTRONICS PACKAGING;

EID: 0033694427     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (15)