Effect of package and board characteristics on solder joint reliability of microstar BGA

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 583-588

  Variyam, Manjula ^a   Chiu, Tz Cheng ^a   Sundararaman, Vish ^a   Edwards, Darvin ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT TESTING; RELIABILITY; RESIDUAL STRESSES; SOLDERED JOINTS; STRESS ANALYSIS; THERMAL CYCLING; THERMAL EXPANSION;

BALL GRID ARRAY; ORGANIC SURFACE PROTECTANT; SOLDER JOINT RELIABILITY;

CHIP SCALE PACKAGES;

EID: 0038689240     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Amagai, M., Kishimoto, K., Shibuya, T., and Omiya, M., "Effect of Intermetallic Compound Layer Development on Interfacial Strength of Solder Joints," Proc InterPack'01, Kauai, HI, July, 2001.
2. Darveaux, R., "Effect of Simulation Methodology on Solder Joint Crack Growth Correlation," Proc 50th Electronic Components and Technology Conf, Las Vegas, NV, May, 2000.
3. JMP Version 5 Help Manual, SAS Institute Inc.
4. Solder Joint Reliability Test Standard SJR-01, Rev. 2, IPC.
5. Walpole, R. E., and Myers, R. H., Probability and Statistics for Engineers and Scientists, Ed 2., McMillan Publishing Company (New York, 1978), pp. 133-136