Solder joint life prediction model based on the strain energy density criterion

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 214-220

  Guven, I ^a   Kradinov, V ^a   Madenci, E ^a   Tor, J L ^a  

^a University of Arizona   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACK INITIATION; CRACK PROPAGATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; RELIABILITY; SOLDERED JOINTS; STATISTICAL METHODS; STRAIN; THERMAL CYCLING;

LIFE PREDICTION MODEL; STRAIN ENERGY DENSITY CRITERION; THERMAL FATIGUE MODELS;

ELECTRONICS PACKAGING;

EID: 0038012877     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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