Integrated inductors in the chip-to-board interconnect layer fabricated using solderless electroplating bonding

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 2002, Pages 1409-1412

  Joung, Yeun Ho ^a   Nuttinck, Sebastien ^a   Yoon, Sang Woong ^a   Allen, Mark G ^a   Laskar, Joy ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRONICS PACKAGING; ELECTROPLATING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT LAYOUT; INTERCONNECTION NETWORKS; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICE STRUCTURES; SUBSTRATES; SURFACE MOUNT TECHNOLOGY;

CHIP TO BOARD INTERCONNECT LAYER; HYBRID MOUNTING; INTEGRATION DENSITY; MAGNETIC CROSS SECTIONAL AREA; QUALITY FACTOR; SOLDERLESS ELECTROPLATING BONDING;

ELECTRIC INDUCTORS;

EID: 0036063403     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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