Modeling of interfacial sliding and film crawling in back-end structures of microelectronic devices

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 3, 2005, Pages 397-407

  Dutta, I ^a   Peterson, Keith A ^b   Park, Chanman ^a   Vella, Joseph ^c  

^a NAVAL POSTGRADUATE SCHOOL   (United States)

^b LAC+USC Medical Center   (United States)

^c Freescale Semiconductor   (United States)

Author keywords

Back end structure; Cu interconnects; Interfacial sliding; Low K dielectric (LKD); Plasticity; Thermo mechanical cycling

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER SIMULATION; FLIP CHIP DEVICES; MATHEMATICAL MODELS; PLASTIC DEFORMATION; PLASTICITY; SHEAR STRESS; THERMAL CYCLING; THERMAL EFFECTS; THERMAL EXPANSION;

BACK-END STRUCTURE; INTERFACIAL SLIDING; THERMOMECHANICAL CYCLING;

MICROELECTRONICS;

EID: 27644465557     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.853588     Document Type: Article

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