Nanoimprint process using epoxy-siloxane low-viscosity prepolymer

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 23, Issue 1, 2005, Pages 72-75

  Viallet, Benòt ^a   Gallo, Pascal ^a   Daran, Emmanuelle ^a  

^a LAAS CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH TEMPERATURE APPLICATIONS; NANOTECHNOLOGY; POLYMERS; REACTIVE ION ETCHING; SILICON; THERMOPLASTICS; VISCOSITY;

EMBOSSING; NANOIMPRINT PROCESS;

EPOXY RESINS;

EID: 27344456157     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1835319     Document Type: Article

References (17)

1. S. Y. Chou, P. R. Krauss, and P. J. Renstrom, Appl. Phys. Lett. 67, 3114 (1995).
2. S. Y. Chou, P. R. Krauss, W. Zhang, L. Guo, and L. Zhuang, J. Vac. Sci. Technol. B 15, 2897 (1997).
3. H.-C. Scheer and H. Schulz, Microelectron. Eng. 56, 311 (2001).
4. H.-C. Scheer, H. Schulz, T. Hoffmann, and C. M. Sotomayor Torres, J. Vac. Sci. Technol. B 16, 3917 (1998).
5. C. M. Sotomayor Torres et al., Mater. Sci. Eng., C 23, 23 (2003).
6. D.-Y. Khang and H. H. Lee, Appl. Phys. Lett. 76, 870 (2000)
7. M. Bender, M. Otto, B. Hadam, B. Vratzov, B. Spangenberg, and H. Kurz, Microelectron. Eng. 53, 233 (2000).
8. S. Matsui, Y. Igaku, H. Ishigaki, J. Fujita, M. Ishida, Y. Ochiai, H. Namatsu, and M. Komuro, J. Vac. Sci. Technol. B 21, 688 (2003).
9. A. Lebib et al., Microelectron. Eng. 61-62, 371 (2002).
10. J. Haisma, M. Verheijen, K. Van den Henvel, and J. Van den Berg, J. Vac. Sci. Technol. B 14, 4124 (1996).
11. T. Bailey, B. J. Choi, M. Colburn, M. Meissl, S. Shaya, J. G. Ekerdt, S. V. Sreenivasan, and C. G. Wilson, J. Vac. Sci. Technol. B 18, 3572 (2000).
12. L. Malaquin, F. Carcenac C. Vieu, and M. Mauzac, Microelectron. Eng. 61-62, 379 (2002); L. Malaquin and C. Vieu, Alternative Lithography, edited by, C. M. Sotomayor Torres, (Kluwer Academic, Boston, 2003), pp. 164-199; using PDMS as a thermocurable resist for a mold-assisted imprint process.
13. L. Malaquin, F. Carcenac C. Vieu, and M. Mauzac, Microelectron. Eng. 61-62, 379 (2002); L. Malaquin and C. Vieu, Alternative Lithography, edited by, C. M. Sotomayor Torres, (Kluwer Academic, Boston, 2003), pp. 164-199; using PDMS as a thermocurable resist for a mold-assisted imprint process.
14. L. Malaquin, F. Carcenac C. Vieu, and M. Mauzac, Microelectron. Eng. 61-62, 379 (2002); L. Malaquin and C. Vieu, Alternative Lithography, edited by, C. M. Sotomayor Torres, (Kluwer Academic, Boston, 2003), pp. 164-199; using PDMS as a thermocurable resist for a mold-assisted imprint process.
15. X. Zhao and R. Kopelman, J. Phys. Chem. 100, 11014 (1996).
16. Y. Liu, K. Wolf, and M. Messmer, Langmuir 17, 4329 (2001).
17. C. J. van Oss, Interfacial Forces in Aqueous Media (Marcel Dekker, New York, 1994).