Novel room-temperature first-level packaging process for microscale devices

Sensors and Actuators, A: Physical

Volumn 123-124, Issue , 2005, Pages 646-654

  Zhang, Wen Yue ^a   Labukas, Joseph P ^b   Tatic Lucic, Svetlana ^a   Larson, Lyndon ^c   Bannuru, Thirumalesh ^a   Vinci, Richard P ^a   Ferguson, Gregory S ^a,b  

^a Lehigh University   (United States)

^b LEHIGH UNIVERSITY   (United States)

^c DOW CORNING CORPORATION   (United States)

Author keywords

Elastomer supported cold welding; Nanoidentation; Photo patternable spin on silicone; Room temperature first level packaging; Self assembled monolayer

Indexed keywords

ELASTOMERS; ELECTRIC POTENTIAL; MONOLAYERS; SELF ASSEMBLY; SILICONES; SURFACE ROUGHNESS; WELDING;

ELASTOMER-SUPPORTED COLD-WELDING; NANOINDENTATION; PHOTO-PATTERNABLE SPIN-ON SILICONE; ROOM-TEMPERATURE FIRST-LEVEL PACKAGING;

MICROELECTROMECHANICAL DEVICES;

EID: 24944568793     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2005.03.008     Document Type: Conference Paper

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