Silicone materials for IC packaging and opto-electronics

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Volumn , Issue , 2001, Pages 324-328

  Vanlathem, Eric ^a   Oellers, Ernst ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUITS; OPTOELECTRONIC DEVICES; REFRACTIVE INDEX; THERMODYNAMIC STABILITY;

MOISTURE RESISTANCE;

SILICONES;

EID: 0035790854     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/polytr.2001.973303     Document Type: Conference Paper

References (0)