Elastomer-supported cold welding for room temperature wafer-level bonding

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2004, Pages 741-744

  Zhang, W Y ^a   Ferguson, G S ^b   Tatic Lucic, S ^a  

^a Lehigh University   (United States)

^b LEHIGH UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELASTIC MODULI; ELASTOMERS; ENCAPSULATION; EVAPORATION; MICROELECTROMECHANICAL DEVICES; PLASMA ETCHING; PRESSURE EFFECTS; PROFILOMETRY; SCANNING ELECTRON MICROSCOPY; SELF ASSEMBLY; STOICHIOMETRY; STRENGTH OF MATERIALS; VACUUM; VISCOSITY;

CALIBRATION CONSTANT; DICING PATTERN; FABRICATION PROCESSES; WAFER-LEVEL BONDING;

COLD WELDING;

EID: 3042698416     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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