SiC via holes by laser drilling

Journal of Electronic Materials

Volumn 33, Issue 5, 2004, Pages 477-480

  Kim, S ^a   Bang, B S ^a   Ren, F ^a   D'Entremont, J ^b   Blumenfeld, W ^b   Cordock, T ^b   Pearton, S J ^a  

^a University of Florida   (United States)

^b Lenox Laser Inc   (United States)

Author keywords

Laser drilling; SiC; Via holes

Indexed keywords

DRILLING; DRY ETCHING; INDUCTANCE; INDUCTIVELY COUPLED PLASMA; LASER APPLICATIONS; MASS SPECTROMETRY; MATERIALS SCIENCE; METALLIZING;

ION ENERGY; LASER DRILLING; SURFACE CONTAMINATION;

SILICON CARBIDE;

EID: 2442426439     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0206-7     Document Type: Conference Paper

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