High thermally conductive epoxy system for electrical and electronic thermal management

Proceedings of the Electrical/Electronics Insulation Conference

Volumn , Issue , 2001, Pages 285-289

  Kultzow, Robert ^a  

^a Vantico Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC LOSSES; ELECTRIC CONDUCTIVITY; ELECTRIC PROPERTIES; MECHANICAL PROPERTIES; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

CONDUCTIVE EPOXY SYSTEM; ELECTRICAL THERMAL MANAGEMENT; ELECTRONIC THERMAL MANAGEMENT; HEAT CURING SYSTEM; THERMAL SHOCK RESISTANCE;

ELECTRIC INSULATION;

EID: 0035199261     PISSN: None     EISSN: None     Source Type: Journal    
DOI: 10.1109/EEIC.2001.965628     Document Type: Article

References (4)

1. Thermal conductivity of thin film carbon fiber die attach
2. Transient thermal conductivity measurements - Comparison of destructive and non-destructive techniques
3. Thermal conductivity of molding compounds for plastics packaging
4. Formulating custom-tailored thermal transfer adhesives