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Volumn , Issue , 1998, Pages 128-133
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Thermal management design criteria and solutions
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Author keywords
[No Author keywords available]
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Indexed keywords
COST EFFECTIVENESS;
HEAT RESISTANCE;
PRESSURE EFFECTS;
THERMAL MANAGEMENT METHOD;
ELECTRONICS PACKAGING;
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EID: 0032291304
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (6)
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References (0)
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