Thermal greases with exceptionally high thermal conductivity and low thermal resistance

Proceedings - 4th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn 1998-March, Issue , 1998, Pages 198-202

  Hunadi, Ron ^a   Wells, Rich ^b  

^a Thermoset Plastics   (United States)

^b Thermoset Plastics   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE; COST EFFECTIVENESS; FILLERS; III-V SEMICONDUCTORS; INTERFACES (MATERIALS); LAPTOP COMPUTERS; NITRIDES; PACKAGING MATERIALS; AGING OF MATERIALS; ATMOSPHERIC HUMIDITY; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; HEAT RESISTANCE; HIGH TEMPERATURE EFFECTS; PHYSICAL PROPERTIES; RELIABILITY; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL CYCLING;

CONSUMER APPLICATIONS; HIGH TEMPERATURE AGING; HIGH THERMAL CONDUCTIVITY; INTERFACE MATERIALS; PHYSICAL AND ELECTRICAL PROPERTIES; POLYMER-BASED SYSTEMS; TEMPERATURE CYCLING; THERMAL INTERFACE MATERIALS;

THERMAL CONDUCTIVITY; LUBRICATING GREASES;

RELIABILITY TEST; THERMAL GREASES; THERMAL INTERFACE MATERIAL;

EID: 0032230601     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1998.664459     Document Type: Conference Paper

References (7)

1. W. Jamison, G. Sears, G. Larson and R. Hunadi, "Thermally Conductive, Water Cleanable Greases", International Electronics Packaging Conference, San Diego, California, September 15-18, 1991, pp. 190-203.
2. W.L. Jamison, G.J. Larsen, G.E. Sears, 'Hydrophilic Thermally Conductive Grease", U.S. Patent 5 167 851, December 1, 1992.
3. W.L. Jamison, G.J. Larsen, G.E. Sears, "Thermal Coupling with Water-Washable Thermally Conductive Grease ", U. S. Patent 5 250 209, October 5, 1993.
4. N.G. Askula et al, "Non-bleeding Thixotropic Thermally Conductive Materials", U.S. Patent 4 255 755, May 5, 1981.
5. N.G. Askula et al, "Thermal Grease with Boron or Aluminum Nitride and Mineral Oil", IBM Tech. Disclosure Bull., vol. 24, no. 74 p. 3530, December 1981.
6. E.R. Mondou et al, "Heat Transfer Compounds", TBM Tech. Disclosure Bull., vol. 25, no. 10, pp. 5320-5322, March 1983.
7. H.R. Anderson, Jr. And R.B. Booth, "Materials/Processing Approaches to Phase Stabilization of Thermally Conductive Pastes", IEEE Trans. Comp., Hybrids, Manuf. Technol. Vol. 13, No.4, December 1990, p.713.